No Clean Probe Card & Pogo Pin Nano-Coating Technology - For IC wafer testing application: >> Cantilever probe card >> Cobra (Vertical) probe card - IC component final test application: >> Pogo pin >> Testing socket pins >> Testing socket pins

• Anti Silver Black & Sulification Technology

- PCB open/ short testing:

>> Anti-Silver-Black & Anti-Silver-SO2

- PLCC & LTCC

• Flexible Electronic Technology

- For RFID applications with simple and low cost semiconductor process.

• Insertion/Driller Coating Titanium Technology(UK)

- For insertion applications with Titanium coating to improve product life 3~5 times.

- Anti-foggy, anti-scratch.

• Conducting Nano material coating for LCD driver probe card.

• Back light module emitting source.

• Printed Field Emission Technology (UK)

- For display applications with high resolution as CRT and thin structure as LCD display.

• BEF and Diffuser Film Technology (UK)

- For backlight module applications with high performance and cost effective solution.

• Quantum Dots Technology(UK)

- For solar cell applications to improve CIGS and Dye efficiency.

• Solar Cell Concentrator Technology (UK)

- With low cost solution to improve efficiency up to 30%.

• Solar Cell Wafer Cutting (Japan)

- Thinner wafer thickness 180um and 150um technology with higher quality and yield.

• Solar Cell Efficiency Improvement Technology (Canada)

- New recipe of SiCxOyNz in PECVD coating to improve 1~3% extra efficiency.

• Direct Methanol Fuel Cell (DMFC) Technology (UK)

- For NB and Mobile phone applications with cost effective solution (No Pt is using).